• Installation of all types of SMD packages, including BGA / CSP fine pitch (0.2mm), QFN, LGA, 0201
  • Assembly of thick card, large size, flex and rigid flexo.
  • Wave soldering leaded and unleaded
  • Repair stations Infrared BGA and QFN components
  • Integration of sub-assemblies and complete products to customer specifications.
  • Axial and radial AutoText
  • Programming of all types of memory, including flash, EPROM and SDram.
  • Proximity and localization in low-cost geographic area.
  • logistics platforms in France and Italy
  • Management provided by the customer.
  • Storage and preservation of all types of electronic components.
  • Steaming components and management levels MSL
  • Proposal for logistics solutions with specific delivery schedule
  • Transport DDU in less than 5 days to most European countries.
  • Inspection SMD stencils 3D & automatic inspection assemblies cards using SPI and AOI Online
  • Development of in situ testing interfaces for TRI tester
  • Development of functional tests following the client's tender specifications
  • Static burn for power cards

Depending on your needs and through our partnership network, we offer turnkey solutions, ranging from the study, development of the electronic card and plastic injection to after-sales of the finished product.